Hi Everyone,

I have tried to address most of the implementation concerns with updated patch-set [1] as follows:

*Concern*: Firmware encryption bit needs to be signed *Address*: Moved the firmware encryption bit from FIP ToC header to "io_uuid_spec_t" struct which is part of "plat_io_policy" that is embedded in the boot-loader (BL1 or BL2) and hence firmware encryption bit is signed.

Also, with this implementation fip_tool is no longer aware of encryption and just encrypted binaries are piped to fip_tool.

*Concern*: Capability to encrypt with different keys for different images *Address*: Passed "img_id" buffer reference as an argument of "plat_get_enc_key_info()" API. So that platforms may choose to either provide a unique key per firmware image or just derive a key from HUK per firmware using "img_id" buffer as a salt.

*Concern*: Coupling of FIP and encryption layer *Address*: Firstly I think we all can agree that encryption layer provides confidentiality protection specific to IO storage. Secondly FIP is actually a packaging layer that sits over actual IO layer and having the encryption layer coupled with FIP provides an abstraction layer for any FIP payload which in turn provides the following features: 1. Allows the firmware certificates to be encrypted as well to protect against cloning satisfying R050_TBBR_PROTECTION requirement. 2. Allows the firmware configuration data to be encrypted as well. 3. Provides a capability to have a secure key store as FIP payload which is protected using HUK.

*Concern*: Allow usage of alternative verify-then-decrypt method *Address*: A platform could disable this encryption layer and implement decryption as part of "bl2_plat_handle_post_image_load()".

Please let me know in case I missed any implementation concerns and feel free to provide your feedback on updated patch-set [1].

[1] https://review.trustedfirmware.org/q/topic:%22tbbr%252Ffw_enc%22+(status:ope...)

Regards, Sumit